Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US9214539B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214539-B2 |
| Application number | US-201314016328-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 3, 2013 |
| Priority date | Sep 3, 2013 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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Some embodiments of the present disclosure relates to a hybrid gate dielectric layer that has good interface and bulk dielectric properties. Surface traps can degrade device performance and cause large threshold voltage shifts in III-N HEMTs. This disclosure uses a hybrid ALD (atomic layer deposited)-oxide layer which is a combination of H2O-based and O3/O2-based oxide layers that provide both good interface and good bulk dielectric properties to the III-N device. The H2O-based oxide layer provides good interface with the III-N surface, whereas the O3/O2-based oxide layer provides good bulk properties.
Opening claim text (preview).
What is claimed is: 1. A III-N (tri nitride) semiconductor device, comprising: a buffer layer disposed above a substrate; a crystalline or poly crystalline III-N layer disposed above the buffer layer; a source region located at a first location in or on the crystalline or poly crystalline III-N layer; a drain region located at a second location in or on the crystalline or poly crystalline III-N layer, wherein the second location is laterally disposed and separated from the…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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