Decoupling device with three-dimensional lead frame and fabricating method thereof

US9214284B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9214284-B2
Application numberUS-201313743327-A
CountryUS
Kind codeB2
Filing dateJan 16, 2013
Priority dateSep 13, 2012
Publication dateDec 15, 2015
Grant dateDec 15, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A decoupling device including a lead frame and at least one capacitor unit set is provided. The lead frame includes a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other. The anode terminal portions are electrically connected through a conductive line. One of the anode terminal portions extends along a first direction to form an extending portion, and the extending portion is bended along a second direction perpendicular to the first direction to form an anode side plate. Each capacitor unit set includes a plurality of capacitor units. The capacitor unit sets are connected in parallel on a same plane and disposed on the lead frame. Each capacitor unit has a cathode portion electrically connected to the cathode terminal portion and an anode portion electrically connected to the anode side plate along the first direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A decoupling device, comprising: a lead frame, comprising a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other, and the anode terminal portions being electrically connected to each other through a conductive line, wherein one of the anode terminal portions extends along a first direction to form an extending portion, and the extending portion of the anode terminal portion is bended along a second direction to form an anode side plate, wherein the first direction is perpendicular to the second direction, wherein the cathode terminal portion includes at least one sub cathode terminal portion, and the at least one sub cathode terminal portion, the anode side plates and the lead frame are foamed integrally; and at least one capacitor unit set, comprising a plurality of capacitor units, wherein the capacitor unit sets are electrically connected to each other in parallel on a same plane and are disposed on the lead frame, and the capacitor units comprised in each of the capacitor unit sets are arranged along the second direction in a stacking manner, and each of the capacitor units has a cathode portion and an anode portion, the cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode side plate along the first direction, wherein the at least one sub cathode terminal portion is disposed between the cathode portions of the adjacent capacitor units and is bended along the second direction to form a cathode side plate. 2. The decoupling device as claimed in claim 1 , wherein the anode portions of the capacitor units are electrically connected to the anode side plate through a conductive adhesive or welding. 3. The decoupling device as claimed in claim 1 , wherein the anode side plate of the lead frame further comprise at least one or more sheets of metal used for electrically connecting the anode portions of the capacitor units along the first direction. 4. The decoupling device as claimed in claim 1 , wherein the anode portions of the capacitor units respectively comprise a sleeve hole used for electrically connecting the anode side plate along the second direction. 5. The decoupling device as claimed in claim 1 , wherein the cathode terminal portion is electrically connected to the cathode portions in a line-shape or a cross-shape. 6. The decoupling device as claimed in claim 1 , wherein the cathode portions of the capacitor units are connected to each other through a conductive adhesive and are stacked on the lead frame. 7. The decoupling device as claimed in claim 1 , wherein the cathode terminal portion further comprises a rough structure disposed on a surface of the cathode terminal portion along the second direction. 8. The decoupling device as claimed in claim 1 , wherein each of the capacitor units comprises: a valve metal layer; a dielectric layer, formed on the valve metal layer; a conductive polymer layer, formed on the dielectric layer; and a cathode conductive layer, formed on the conductive polymer layer. 9. The decoupling device as claimed in claim 8 , wherein a material of the valve metal layer is selected from aluminium, tantalum, niobium, niobium oxide, titanium and a combination thereof. 10. The decoupling device as claimed in claim 8 , wherein the dielectric layer is a metal oxide of the valve metal layer. 11. The decoupling device as claimed in claim 8 , wherein the cathode conductive layer comprises a carbon adhesive layer and a silver adhesive layer. 12. The decoupling device as claimed in claim 1 , further comprising an insulation layer disposed above the conductive line, wherein the cathode terminal portion and the anode terminal portions are insulated from each other through the insulation layer. 13. A three-dimensional lead frame, adapted to carry at least one capacitor unit set, comprising: a cathode terminal portion, having a space; a conductive line, disposed in the space; and at least two anode terminal portions, disposed at two sides of the cathode terminal portion and opposite to each other, and electrically connected to each other through the conductive line, wherein one of the anode terminal portions extends outwards along a first direction to form an extending portion, and the extending portion of the anode terminal portion is bended along a second direction to form an anode side plate, and the first direction is perpendicular to the second direction, wherein the cathode terminal portion includes at least one sub cathode terminal portion, and the at least one sub cathode terminal portion, the anode side plates and the lead frame are formed integrally, wherein the at least one sub cathode terminal portion is disposed between the cathode portions of the adjacent capacitor units and is bended along the second direction to form a cathode side plate. 14. The three-dimensional lead frame as claimed in claim 13 , wherein a material of the at least one cathode side plate is a metal or an alloy. 15. The three-dimensional lead frame as claimed in claim 13 , wherein the cathode terminal portion has a rough structure on a surface along the second direction. 16. The three-dimensional lead frame as claimed in claim 13 , wherein a material of the anode side plate is a metal or an alloy. 17. The three-dimensional lead frame as claimed in claim 13 , further comprising an insulation layer disposed on a predetermined position, for electrically insulating the anode terminal portions and the cathode terminal portion. 18. A method for fabricating a decoupling device, comprising: providing a lead frame comprising a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other, the anode terminal portions being electrically connected to each other through a conductive line, wherein at least one of the anode terminal portions extends outwards along a first direction to form an extending portion, and the extending portion of the anode terminal portion is bended along a second direction to form an anode side plate, wherein the first direction is perpendicular to the second direction, wherein the cathode terminal portion includes at least one sub cathode terminal portion, and the at least one sub cathode terminal portion, the anode side plates and the lead frame are formed integrally; and providing at least one capacitor unit set comprising a plurality of capacitor units, wherein the capacitor unit sets are electrically connected to each other in parallel on a same plane and are disposed on the lead frame, the capacitor units comprised in each of the capacitor unit sets are arranged along the second direction in a stacking manner, and each of the capacitor units has a cathode portion and an anode portion, the cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode side plate along the first direction, wherein the at least one sub cathode terminal portion is disposed between the cathode portions of the adjacent capacitor units and is bended along the second direction to form a cathode side plate.

Assignees

Inventors

Classifications

  • characterised by their structure (H01G11/22 takes precedence) · CPC title

  • by assembling plural parts · CPC title

  • Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28) · CPC title

  • Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other · CPC title

  • H01G9/012Primary

    specially adapted for solid capacitors · CPC title

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Frequently asked questions

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What does patent US9214284B2 cover?
A decoupling device including a lead frame and at least one capacitor unit set is provided. The lead frame includes a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other. The anode terminal portions are electrically connected through a conductive line. One of the anode terminal portions extends along …
Who is the assignee on this patent?
Ind Tech Res Inst
What technology area does this patent fall under?
Primary CPC classification H01G9/012. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).