Solvent system enabling thin film deposition of epoxy adhesives for high density piezo printhead interstitial bonding

Patent metadata

Field	Value
Publication number	US-9206341-B2
Application number	US-201414253730-A
Country	US
Kind code	B2
Filing date	Apr 15, 2014
Priority date	Apr 15, 2014
Publication date	Dec 8, 2015
Grant date	Dec 8, 2015

Abstract

The disclosure provides a solvent system for dissolving an epoxy adhesive such as I2300L epoxy adhesive. The solvent system includes a dialkyl ether solvent and an alkyl alcohol solvent. The disclosure also provides methods for preparing a uniform thin film deposit of an epoxy adhesive for printhead interstitial bonding during their fabrication.

First claim

What is claimed is:

1. An epoxy adhesive solution, comprising:
an epoxy adhesive;
a dialkyl ether solvent selected from the group consisting of dimethoxymethane and dimethoxyethane; and
an alkyl alcohol solvent that is methanol;
wherein the methanol is present in an amount of from about 25 weight % to about 35 weight % of the solution.

2. The solution of claim 1 , wherein the dialkyl ether solvent is dimethoxyethane.

3. The solution of claim 1 , wherein the epoxy adhesive comprises an epoxy cresol polymer.

4. The solution of claim 1 , wherein the epoxy adhesive comprises an epoxy ortho-cresol polymer, a bis-phenol A epoxy polymer, and dicyandiamide.

5. The solution of claim 4 , wherein the epoxy adhesive exists exclusive of fumed silica.

6. The solution of claim 1 , wherein the epoxy adhesive is present in an amount of from about 1 weight % to about 10 weight % of the solution.

7. An epoxy adhesive solution, comprising:
an epoxy cresol polymer adhesive;
a dialkyl ether solvent; and
an alkyl alcohol solvent;
wherein the dialkyl ether solvent is dimethoxyethane and the alkyl alcohol solvent is methanol;
wherein the dimethoxyethane is present in an amount of from about 65 weight % to about 75 weight % of the solution.

8. The solution of claim 7 , wherein the methanol is present in an amount of from about 25 weight % to about 35 weight % of the solution.

9. The solution of claim 7 , wherein the epoxy adhesive comprises an epoxy ortho-cresol polymer, a bis-phenol A epoxy polymer, and dicyandiamide.

10. The solution of claim 7 , wherein the epoxy cresol polymer is present in an amount of from about 1 weight % to about 10 weight % of the solution.

11. The solution of claim 7 , wherein the epoxy adhesive has a bonding strength of from about 200 psi to about 3,000 psi.

12. A high density (HD) printhead, comprising:
a plurality of layers; and
an epoxy adhesive between two of the layers, wherein the epoxy adhesive is formed from a solution that includes:
an epoxy cresol polymer adhesive; and
dimethoxyethane that is present in an amount of from about 65 weight % to about 75 weight % of the solution.

13. The printhead of claim 12 , wherein the epoxy adhesive has a bonding strength of from about 200 psi to about 3,000 psi.

14. The printhead of claim 12 , wherein the epoxy adhesive has a film thickness of from about 1 micron to about 25 microns.

15. The printhead of claim 12 , wherein the epoxy adhesive has a surface roughness of from about 0.1 micron to about 1 micron, peak to valley.

16. The printhead of claim 12 , wherein the epoxy adhesive has a weight gain of from about 0.1% to about 10% over thirty two weeks.

17. The printhead of claim 12 , wherein one of the layers comprises polyimide.

Assignees

• Xerox Corp

Inventors

• Zuo Yanjia
• Kanungo Mandakini
• Rao Pratima Gattu Naga
• Badesha Santokh
• Andrews John R

Classifications

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J163/04

  Epoxynovolacs · CPC title

• C08K5/06

  Ethers; Acetals; Ketals; Ortho-esters · CPC title

• B41J2/135

  Nozzles · CPC title

• C08K5/05

  Alcohols; Metal alcoholates · CPC title