Light emitting device and optical device

Patent metadata

Field	Value
Publication number	US-9202989-B2
Application number	US-201414474839-A
Country	US
Kind code	B2
Filing date	Sep 2, 2014
Priority date	Nov 19, 2010
Publication date	Dec 1, 2015
Grant date	Dec 1, 2015

Abstract

A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.

First claim

What is claimed is:

1. A light emitting device, comprising:
an integrally molded substrate having an upper surface, a concave part defined in the upper surface, and a first substrate lateral facing one side of an orthogonal direction with respect to the direction that is defined from the substrate toward the LED chip and is contained in the thickness direction of the substrate;
a wiring pattern at least formed on the upper surface and the concave part;
an LED chip bonded to the concave part;
a metal wire connecting to the LED chip;
a back conductor layer formed on one side of the substrate that is opposite to the side of disposing the LED chip and comprising an end surface facing the same side as the first substrate lateral, and the end surface having a portion spaced apart from the first substrate lateral and another portion located on the same plane as the first substrate lateral; and
a back covering portion covering the back conductor layer;
wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.

2. The light emitting device as claimed in claim 1 , wherein the substrate comprises a second substrate lateral facing the opposite side as the first substrate lateral.

3. The light emitting device as claimed in claim 1 , further comprising a front conductor layer formed on the substrate, which has a spacing formed thereon for defining a vent hole.

4. The light emitting device as claimed in claim 1 , wherein the end surface comprises another portion located on the same plane as the first substrate lateral.

5. The light emitting device as claimed in claim 1 , further comprising:
a front conductor layer formed on the substrate;
the metal wire bonded to the front conductor layer and the LED chip; and
a protective layer covered a bonding position of the metal wire and the front conductor layer.

6. The light emitting device as claimed in claim 1 , further comprising:
a front conductor layer formed on the substrate;
wherein the metal wire has a first bonding portion connecting to the front conductor layer and a second bonding portion connecting to the LED chip.

7. The light emitting device as claimed in claim 1 , wherein the LED chip emits infrared light.

8. The light emitting device as claimed in claim 1 , wherein the LED chip includes a first end directly bonded to a first bottom electrode formed on the first bottom surface and a second end wire-bonded, via the metal wire, to a second bottom electrode formed on the second bottom surface.

9. The light emitting device as claimed in claim 1 , wherein the first and second cavities are positioned side by side, the first cavity has a paraboloidal or pyramidal shape and the first bottom surface has a circular shape, and the second cavity has a shape of pyramidal holder or conical holder and the second bottom surface has a rectangular shape.

10. An optical device, comprising:
a light emitting device as claimed in claim 1 ;
a circuit substrate; and
a solder layer used to bond the light emitting device and the circuit substrate together.

11. The optical device as claimed in claim 10 , further comprising a light receiving device installed on the circuit substrate.

Assignees

• Rohm Co Ltd

Inventors

• Tanuma Yuki

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title