Multi-layer single chip MEMS WLCSP fabrication
US-10106399-B1 · Oct 23, 2018 · US
US9199840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9199840-B2 |
| Application number | US-201314069633-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 1, 2013 |
| Priority date | Nov 1, 2013 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
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The invention claimed is: 1. A method of fabricating a sensor device, the method comprising: forming a plurality of sensor structures on a wafer; covering the plurality of sensor structures with a polymer layer; dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer; and removing at least part of the polymer layer from each die after dicing the wafer. 2. The method of claim 1 , wherein: forming the pl…
Operations & Transport · mapped topic
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