Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
US-2015353347-A1 · Dec 10, 2015 · US
Method of hermetically sealing a hole with a fuse material
US9199839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9199839-B2 |
| Application number | US-201414551701-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2014 |
| Priority date | Dec 6, 2013 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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Abstract
Official abstract text for this publication.
Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of hermetically sealing a hole in a surface of a layer with a fuse material, comprising at least the following steps: applying a wettable material on an area of the surface such that the wettable material completely surrounds the hole in the surface and all the wettable material is located outside the hole, or such that the wettable material completely surrounds a first part of said surface corresponding to a location of the hole and all the…
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- B81C1/00293Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9199839B2 cover?
- Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of …
- Who is the assignee on this patent?
- Commissariat Energie Atomique, Epcos Ag, Commissariat à l'énergie atomique et aux énergies alternatives
- What technology area does this patent fall under?
- Primary CPC classification B81C1/00293. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).