Polishing apparatus
US-2015352682-A1 · Dec 10, 2015 · US
Polishing apparatus, polishing method and pressing member for pressing a polishing tool
US9199352B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9199352-B2 |
| Application number | US-98648111-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 7, 2011 |
| Priority date | Jan 15, 2010 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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Abstract
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A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.
First claim
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What is claimed is: 1. A polishing apparatus for polishing a peripheral portion of a substrate, the peripheral portion including a near-edge portion having an annular flat surface, said polishing apparatus comprising: a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate; at least one polishing head disposed near the near-edge portion of the substrate; and a polishing-tool supply mechanism configured to supply a strip-shaped pol…
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- What does patent US9199352B2 cover?
- A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending…
- Who is the assignee on this patent?
- Seki Masaya, Ito Kenya, Nakanishi Masayuki, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B24B9/065. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).