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US9196576B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9196576-B2 |
| Application number | US-201414277801-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 15, 2014 |
| Priority date | Sep 25, 2013 |
| Publication date | Nov 24, 2015 |
| Grant date | Nov 24, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.
First claim
Opening claim text (preview).
The invention claimed is: 1. A lead frame for a packaged semiconductor device, the lead frame comprising: a heat sink structure defining a first plane; a die paddle defining a second plane substantially parallel to and spaced from the first plane, wherein the die paddle comprises two intersecting arms forming an X-shape having four triangular openings, and the heat sink structure comprises four triangular pads corresponding to the four triangular openings in the X-shaped die pad…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9196576B2 cover?
- A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the…
- Who is the assignee on this patent?
- Yow Kai Yun, Eu Poh Leng, Lye Meng Kong, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/461. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).