Semiconductor device to be attached to heat radiation member

Patent metadata

Field	Value
Publication number	US-9196561-B2
Application number	US-201414339653-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Aug 2, 2013
Publication date	Nov 24, 2015
Grant date	Nov 24, 2015

Abstract

A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region.

First claim

What is claimed is:

1. A semiconductor device comprising
a semiconductor module including a plurality of heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members, and
a pressing member pressing the semiconductor module to a heat radiation member, wherein
the semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure,
at least one of the conductive members is mounted with the heat generation element disposed outside the heat radiation possible region, and
the at least one of the conductive members has such a shape that at least a part of the conductive member is included in the heat radiation possible region.

2. The semiconductor device according to claim 1 , wherein
the at least one of the conductive members includes a base portion on which the heat generation element is mounted and a protruding portion protruding from an end of the base portion adjacent to the pressing member.

3. The semiconductor device according to claim 2 , wherein
each of the conductive members includes the protruding portion.

4. The semiconductor device according to claim 2 , wherein
an area of the protruding portion is smaller than an area of the base portion.

5. The semiconductor device according to claim 2 , wherein
at least one of the conductive members is mounted with only one of the heat generation elements.

6. The semiconductor device according to claim 2 , wherein
at least one of the conductive members is mounted with more than one of the heat generation elements.

7. The semiconductor device according to claim 1 , wherein
the heat generation elements include a plurality of switching elements forming an inverter section, and
each of the conductive members mounted with the switching elements has such a shape that at least a part of each of the conductive members is included in the heat radiation possible region corresponding to the pressing member.

8. The semiconductor device according to claim 1 , wherein
the heat generation elements include a plurality of switching elements forming an inverter section and a power supply relay connected between the inverter section and a power supply source, and
each of the conductive members mounted with the switching elements and the power supply relay has such a shape that at least a part of each of the conductive members is included in the heat radiation possible region corresponding to the pressing member.

9. The semiconductor device according to claim 1 , wherein
the heat generation elements include a plurality of switching elements forming an inverter section, a power supply relay connected between the inverter section and a power supply source, and a load relay connected between the inverter section and a load, and
each of the conductive members mounted with the switching elements, the power supply relay, and the load relay has such a shape that at least a part of each of the conductive members is included in the heat radiation possible region corresponding to the pressing member.

Assignees

• Denso Corp

Inventors

• Fujita Toshihiro

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/652

  comprising metals or metalloids, e.g. silver · CPC title

• H10W40/235

  attached to package parts · CPC title