Resist underlayer composition, method of forming patterns and semiconductor integrated circuit device including the patterns

US9195136B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9195136-B2
Application numberUS-201314088509-A
CountryUS
Kind codeB2
Filing dateNov 25, 2013
Priority dateApr 25, 2013
Publication dateNov 24, 2015
Grant dateNov 24, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

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A resist underlayer composition, a method of forming patterns, and semiconductor integrated circuit device, the composition including a solvent; and a compound including a moiety represented by the following Chemical Formula 1:

First claim

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What is claimed is: 1. A resist underlayer composition, comprising: a solvent; and a compound including a moiety represented by the following Chemical Formula 1: wherein, in Chemical Formula 1, A 1 and A 2 are each independently one selected from the following Group 1, B 1 is one selected from the following Group 2, and R 1 and R 2 are ea…

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What does patent US9195136B2 cover?
A resist underlayer composition, a method of forming patterns, and semiconductor integrated circuit device, the composition including a solvent; and a compound including a moiety represented by the following Chemical Formula 1:
Who is the assignee on this patent?
Kwon Hyo-Young, Kim Min-Gyum, Lee Jun-Ho, and 2 more
What technology area does this patent fall under?
Primary CPC classification G03F7/092. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).