Heat-sink/connector system for light emitting diode

Patent metadata

Field	Value
Publication number	US-9194573-B2
Application number	US-201113994019-A
Country	US
Kind code	B2
Filing date	Dec 14, 2011
Priority date	Dec 15, 2010
Publication date	Nov 24, 2015
Grant date	Nov 24, 2015

Abstract

An assembly for high-powered LEDs provides a direct attachment of the LED to a ceramic thermal conductor/electrical insulator sealed in a housing with a compression element between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink.

First claim

What is claimed is:

1. An LED assembly comprising:
an LED dissipating during operation at least 500 mW;
a ceramic heat sink providing a first surface supporting the LED and in thermal communication with the LED;
a first and second conductor in electrical communication with the LED;
a sealed housing receiving the ceramic heat sink and LED therein, the sealed housing having a first portion fitting over the LED to permit the passage of light therethrough and a second portion providing for sealed ingress of the first and second electrical conductors through a housing wall for providing power to the LED; and
a compression element extending between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink;
wherein the spring clamp is a flexible metal ring; and
wherein the first portion of the sealed housing provides a ledge abutting a portion of the first surface of the ceramic heat sink and a collar extending around a portion of the ceramic heat sink behind the first surface and wherein the spring clamp includes cantilevered teeth portions providing a wedging engagement with an inner surface of the collar to hold the flexible metal ring in abutment with a second surface of ceramic heat sink behind the first surface.

2. The LED assembly of claim 1 wherein the first portion of the sealed housing is a light transmissive thermoplastic and the second portion of the sealed housing is a thermoplastic fused to the first portion.

3. The LED assembly of claim 2 wherein the electrical conductors provide integral coaxial thermoplastic insulation and where the second portion of the sealed housing is fused to the thermoplastic insulation.

4. The LED assembly of claim 1 wherein the compression element is a flexible metal ring.

5. The LED assembly of claim 1 wherein the metal ring further includes protrusions contacting the second surface and limiting the force applied thereto.

6. The LED assembly of claim 1 wherein the first surface includes metal traces attached directly to the first surface and electrically communicating between the LED and first and second conductors.

7. The LED assembly of claim 6 wherein the metal traces are printed conductive ink.

8. The LED assembly of claim 1 wherein the ceramic is Steatite.

9. The LED assembly of claim 1 wherein the first surface includes conductive traces attached directly to the first surface; and further including:
a first and second spring clamp insertable through apertures in the ceramic heat sink and each having first portions contacting different conductive traces when so inserted and clamping elements receiving and retaining different of the first and second conductors.

10. The LED assembly of claim 9 wherein the first portion is spring biased by the spring clamp against the conductive trace.

11. The LED assembly of claim 9 wherein the metal traces are printed conductive ink.

12. The LED assembly of claim 9 wherein the first and second conductors provide flexible opposed spring elements slidably receiving ends of the conductors in electrical engagement.

13. The LED assembly of claim 9 wherein the ceramic is Steatite.

14. A method of fabricating an LED assembly including:
an LED dissipating during operation at least 500 mW;
a ceramic heat sink providing a first surface supporting the LED in thermal communication with the LED;
a first and second conductor in electrical communication with the LED;
a sealed housing receiving the ceramic heat sink and LED therein, the sealed housing having a first portion fitting over the LED to permit the passage of light therethrough and a second portion providing for sealed ingress of the first and second electrical conductors through a housing wall for providing power to the LED; and
a compression element extending between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force pressing the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink;
the method comprising the steps of:
(a) attaching the LED to the first surface of the ceramic heat sink;
(b) fitting the assembled LED and ceramic heat sink into one the first portion of the housing and retaining the ceramic heat sink in the first portion with the spring clamp;
(c) overmolding the first portion and the conductors with a thermoplastic material providing the second portion of the housing providing a sealed volume holding the ceramic substrate and LED; and
wherein the first portion of the sealed housing provides a ledge abutting a portion of the first surface of the ceramic heat sink and a collar extending around a portion of the ceramic heat sink behind the first surface and including the step of press fitting the spring clamp into engagement with an inner surface of the collar and a second surface of ceramic heat sink behind the first surface.

Assignees

• Barrena Juan J
• Claprood Edward J
• Larson Eric K
• Illinois Tool Works

Inventors

• Barrena Juan J
• Claprood Edward J
• Larson Eric K

Classifications

• F21V29/70 Primary

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V17/00

  Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages (of light sources or light holders F21V19/00) · CPC title

• F21V17/164

  the parts being subjected to bending, e.g. snap joints · CPC title

• F21K9/00 Primary

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title