Manufacturing method for thin board-shaped fired piezoelectric body

Patent metadata

Field	Value
Publication number	US-9190604-B2
Application number	US-201113273608-A
Country	US
Kind code	B2
Filing date	Oct 14, 2011
Priority date	Apr 24, 2009
Publication date	Nov 17, 2015
Grant date	Nov 17, 2015

Abstract

A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.

First claim

The invention claimed is:

1. A manufacturing method for a thin board-shaped fired piezoelectric body, the method comprising:
a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within a surface of the green sheet after firing; and
a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by the firing of the green sheet with the reinforcing members for firing on at least one surface of the green sheet after disposing the individual reinforcing members for firing by scattering on the at least one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later.

2. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein the ratio T/L is 0.001 to 0.06.

3. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
where the reinforcing members for firing are scattered on the at least on-one surface of the green sheet to be symmetrical about a point.

4. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 3 ,
wherein the reinforcing members for firing have a shape where a continued lattice shape is segmentalized to remove parts and are scattered on the at least on one surface of the green sheet.

5. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 3 ,
wherein the reinforcing members for firing are formed by screen printing to dispose the reinforcing members for firing on the at least on-one surface of the green sheet.

6. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 3 ,
wherein, after the reinforcing members for firing are scattered and disposed on a reinforcing plate for firing which is thicker than the green sheet in advance, the surface having the reinforcing members for firing disposed on the reinforcing plate for firing is bonded to the green sheet to dispose the reinforcing members for firing on the at least on one surface of the green sheet.

7. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 3 ,
wherein the reinforcing members for firing are thicker than the green sheet.

8. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 3 ,
wherein, after the step of obtaining the thin board-shaped fired piezoelectric body with the reinforcing members for firing, the method has a step of obtaining the thin board-shaped fired piezoelectric body by removing the reinforcing members for firing from the thin board-shaped fired piezoelectric body with the reinforcing members for firing by cutting, and
wherein the cutting method is one selected from a cutting means of a grinding stone method, a water jet method, an etching method, and a sandblasting method.

9. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein the reinforcing members for firing have a shape where a continued lattice shape is segmentalized to remove parts and are scattered on the at least on-one surface of the green sheet.

10. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 9 ,
wherein the reinforcing members for firing are formed by screen printing to dispose the reinforcing members for firing on the at least one surface of the green sheet.

11. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 9 ,
wherein, after the reinforcing members for firing are scattered and disposed on a reinforcing plate for firing which is thicker than the green sheet in advance, the surface having the reinforcing members for firing disposed on the reinforcing plate for firing is bonded to the green sheet to dispose the reinforcing members for firing on the at least one surface of the green sheet.

12. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 9 ,
wherein the reinforcing members for firing are thicker than the green sheet.

13. A manufacturing method for a thin hoard-shaped fired piezoelectric body according to claim 9 ,
wherein, after the step of obtaining the thin board-shaped fired piezoelectric body with the reinforcing members for firing, the method has a step of obtaining the thin board-shaped fired piezoelectric body by removing the reinforcing members for firing from the thin board-shaped fired piezoelectric body with the reinforcing members for firing by cutting, and
wherein the cutting method is one selected from the cutting means consisting of a grinding stone method, a water jet method, an etching method, and a sandblasting method.

14. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein the reinforcing members for firing are formed by screen printing to dispose the reinforcing members for firing on the at least on one surface of the green sheet.

15. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein, after the reinforcing members for firing are scattered and disposed on a reinforcing plate for firing which is thicker than the green sheet in advance, the surface having the reinforcing members for firing disposed on the reinforcing plate for firing is bonded to the green sheet to dispose the reinforcing members for firing on the at least one surface of the green sheet.

16. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein the reinforcing members for firing are thicker than the green sheet.

17. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 ,
wherein, after the step of obtaining the thin board-shaped fired piezoelectric body with the reinforcing members for firing, the method has a step of obtaining the thin board-shaped fired piezoelectric body by removing the reinforcing members for firing from the thin board-shaped fired piezoelectric body with the reinforcing members for firing by cutting, and
wherein the cutting method is one selected from a cutting means of a grinding stone method, a water jet method, an etching method, and a sandblasting method.

18. A manufacturing method for a thin board-shaped fired piezoelectric body according to claim 1 , wherein the reinforcing members for firing have one of a shape that is cross-shaped, a shape of two connected crosses, and a circular shape.

19. A manufacturing method for a piezoelectric element, the method comprising:
a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within a surface of the green sheet after firing;
a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by the firing of the green sheet with the reinforcing members for tiring on at least one surface of the green sheet after disposing the individual reinforcing members for firing by scattering on the at least one surface of the green sheet so as to exclude areas to be the thin board-shaped fired piezoelectric body later; and
a step of forming a membrane-shaped electrode in areas to be the thin board-shaped fired piezoelectric body later in the thin board-shaped fired piezoelectric body with the reinforcing members for firing.

Assignees

• Takahashi Nobuo
• Ohnishi Takao
• Ngk Insulators Ltd

Inventors

• Takahashi Nobuo
• Ohnishi Takao

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• C04B35/62222

  obtaining ceramic coatings (coating of mortars, concrete, artificial or natural stone or ceramics C04B41/45; laminated ceramic products B32B18/00; coating of glass C03C17/00, applying ceramic coatings on silicon for semi-conductor purposes H10W; coating metallic materials C23) · CPC title

• C04B35/634

  Polymers (C04B35/636 takes precedence) · CPC title

• Y10T29/49005

  Acoustic transducer · CPC title

• Y10T29/49126

  Assembling bases · CPC title