Semiconductor device and semiconductor die
US-2024387542-A1 · Nov 21, 2024 · US
US9190409B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9190409-B2 |
| Application number | US-201414187745-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2014 |
| Priority date | Feb 25, 2013 |
| Publication date | Nov 17, 2015 |
| Grant date | Nov 17, 2015 |
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Official abstract text for this publication.
A method and structure for a semiconductor device includes a semiconductor substrate and an N-channel transistor and a P-channel transistor provided on the semiconductor substrate. Each of the N-channel transistor and the P-channel transistor has a gate dielectric film on the semiconductor substrate, and a gate electrode is formed on the gate dielectric. The gate electrode comprises a metal conductive layer. The oxygen concentration in the metal conductive layer for the N-channel transistor is different from that for the P-channel transistor.
Opening claim text (preview).
Having thus described my invention, what I claim as new and desire to secure by Letters Patent is as follows: 1. A semiconductor device, comprising: a semiconductor substrate; and an N-channel transistor and a P-channel transistor provided on the semiconductor substrate, each of the N-channel transistor and the P-channel transistor respectively having a gate dielectric film on said semiconductor substrate, and a gate electrode respectively formed on said gate dielectric, wher…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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