Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor device
US9190397B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9190397-B2 |
| Application number | US-201214359038-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2012 |
| Priority date | Feb 14, 2012 |
| Publication date | Nov 17, 2015 |
| Grant date | Nov 17, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in response to a signal from outside. The communication device transmits the control signal. The communication device receives the control signal and supplies the control signal to the drive circuit, which drives the semiconductor element in response to the control signal. The resin electrically insulates the connection circuit and the communication device from the communication device and the drive circuit enabling prevention of breakdown of the connection circuit caused by an application of a high voltage from the drive circuit to the connection circuit.
First claim
Opening claim text (preview).
The invention claimed is: 1. A semiconductor device comprising: first and second cooling bodies; a semiconductor element sandwiched between a lower surface of the first cooling body and an upper surface of the second cooling body; a connection circuit provided on the lower surface of the first cooling body and generating a control signal in response to a signal from outside; a drive circuit provided on the upper surface of the second cooling body and driving the semiconduct…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9190397B2 cover?
- A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in respon…
- Who is the assignee on this patent?
- Miyamoto Noboru, Tsunoda Yoshikazu, Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).