Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Multi-die sensor device
US9190352B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9190352-B2 |
| Application number | US-201314086942-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2013 |
| Priority date | Nov 21, 2013 |
| Publication date | Nov 17, 2015 |
| Grant date | Nov 17, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device includes a lead frame having a flag and leads that surround the flag. The leads include a dummy lead that has first and second wire bonding areas. A first die is attached on the flag and electrically connected to the first wire bonding area. The first die and the first wire bonding area are encapsulated with a molding material and a cavity with an opening is formed above the first die. The second wire bonding area is exposed in the cavity. A second die is placed in the cavity and electrically connected to the second wire bonding area such that the second die is electrically connected to the first die by way of the dummy lead.
First claim
Opening claim text (preview).
The invention claimed is: 1. A semiconductor device, comprising: a lead frame having a flag and a plurality of leads surrounding the flag, wherein the plurality of leads comprises at least one normal lead and at least one dummy lead that has a first wire bonding area formed in a first plane and a second wire bonding area formed in a second plane, wherein the first plane is down-set from the second plane; a first die attached on a top surface of the flag and electrically connecte…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9190352B2 cover?
- A semiconductor device includes a lead frame having a flag and leads that surround the flag. The leads include a dummy lead that has first and second wire bonding areas. A first die is attached on the flag and electrically connected to the first wire bonding area. The first die and the first wire bonding area are encapsulated with a molding material and a cavity with an opening is formed above …
- Who is the assignee on this patent?
- Tiu Kong Bee, Lau Teck Beng, Lo Wai Yew, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W90/811. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).