Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layer

Patent metadata

Field	Value
Publication number	US-9190207-B2
Application number	US-201313871767-A
Country	US
Kind code	B2
Filing date	Apr 26, 2013
Priority date	Feb 20, 2013
Publication date	Nov 17, 2015
Grant date	Nov 17, 2015

Abstract

There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

First claim

What is claimed is:

1. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
a plurality of internal electrodes stacked within the ceramic body; and
external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes,
wherein the external electrodes include a metal layer directly connected to the internal electrodes and a conductive resin layer formed on the metal layer and connected to the internal electrodes via the metal layer,
the metal layer including glass materials, and
the conductive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more in the conductive resin layer and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more in the conductive resin layer and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

2. The multilayer ceramic electronic component of claim 1 , wherein in the first copper powder, a content of the spherical powder particles is equal to or greater than a content of the flake type powder particles.

3. The multilayer ceramic electronic component of claim 1 , wherein the spherical powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.45 or smaller.

4. The multilayer ceramic electronic component of claim 1 , wherein the flake type powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.95 or greater.

5. The multilayer ceramic electronic component of claim 1 , wherein an equivalent series resistance (ESR) of the multilayer ceramic electronic component satisfies 0.1 mΩ≦ESR≦30 mΩ.

6. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
a plurality of internal electrodes stacked within the ceramic body; and
external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes,
wherein the external electrodes include a metal layer directly connected to the internal electrodes and a conductive resin layer formed on the metal layer and connected to the internal electrodes via the metal layer,
the metal layer including glass materials, and
the conductive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a particle diameter of 2 μm or greater and a second copper powder having a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles, an area occupied by the first copper powder in the conductive resin layer being 10% or more, and an area occupied by the second copper powder in the conductive resin layer being 5% or more.

7. The multilayer ceramic electronic component of claim 6 , wherein in the first copper powder, an area occupied by the spherical powder particles in the external electrodes is equal to or greater than an area occupied by the flake type powder particles in the external electrodes.

8. The multilayer ceramic electronic component of claim 6 , wherein the spherical powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.45 or smaller.

9. The multilayer ceramic electronic component of claim 6 , wherein the flake type powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.95 or greater.

10. The multilayer ceramic electronic component of claim 6 , wherein an equivalent series resistance (ESR) of the multilayer ceramic electronic component satisfies 0.1 mΩ≦ESR≦30 mΩ.

Assignees

• Samsung Electro Mech

Inventors

• Hong Kyung Pyo
• Jeon Byung Jun
• Chun Byoung Jin
• Han Jae Hwan

Classifications

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title