Microarray package device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9187846-B2
Application number	US-93848510-A
Country	US
Kind code	B2
Filing date	Nov 3, 2010
Priority date	Mar 23, 2010
Publication date	Nov 17, 2015
Grant date	Nov 17, 2015

Abstract

A microarray package device and a method of manufacturing the same. An effective microarray analyzing reaction is performed by using the microarray package device that provides structural stability and reliable experimental results.

First claim

What is claimed is:

1. A microarray package device comprising:
a microarray substrate including a front surface on which a biomaterial probe is disposed;
a package substrate comprising a microarray accommodation unit, wherein the microarray accommodation unit comprises:
a bottom;
at least one concave portion disposed in the bottom; and
a sidewall connected to the bottom,
wherein, when a bottom surface of the microarray substrate is attached to the bottom of the microarray accommodation unit, the bottom surface of the microarray substrate is aligned with the at least one concave portion, and the sidewall of the microarray accommodation unit faces a side surface of the microarray substrate; and
an adhesive disposed in a space between the bottom surface of the microarray substrate and the bottom of the microarray accommodation unit which adheres the microarray substrate and the package substrate to each other, wherein the adhesive fills and covers the at least one concave portion, and
wherein the microarray accommodation unit further comprises at least one protrusion which protrudes longitudinally towards a side surface of the microarray substrate when a bottom surface of the microarray substrate is attached to the bottom of the microarray accommodation unit.

2. The microarray package device of claim 1 , wherein the microarray substrate comprises at least one of silicon and glass.

3. The microarray package device of claim 1 , wherein a cross section of the concave portion has at least one of a triangular, rectangular, semicircular and elliptical shape.

4. The microarray package device of claim 1 , wherein the protrusion protrudes from the sidewall towards the side surface of the microarray substrate when a bottom surface of the microarray substrate is attached to the bottom of the microarray accommodation unit.

5. The microarray package device of claim 1 , wherein the package substrate comprises plastic.

6. A method of manufacturing a microarray package device of claim 1 , the method of comprising:
providing a microarray substrate including a front surface on which a biomaterial probe is disposed;
providing a package substrate comprising a microarray accommodation unit comprising:
a bottom;
at least one concave portion disposed in the bottom; and
a sidewall connected to the bottom; and
adhering the microarray substrate and the package substrate to each other with an adhesive which fills and covers the at least one concave portion.

7. The method of claim 6 , wherein the microarray substrate comprises at least one of silicon and glass.

8. The method of claim 6 , wherein a cross section of the concave portion has at least one of a triangular, rectangular, semicircular, and elliptical shape.

9. The method of claim 6 , wherein the protrusion protrudes from the sidewall to the side surface of the microarray substrate.

10. The method of claim 6 , wherein the package substrate comprises plastic.

Assignees

• Lee Woochang
• Shim Jeo-Young
• Lee Myo-Yong
• Namkoong Kak
• Chung Won-Seok
• Samsung Electronics Co Ltd

Inventors

• Lee Woochang
• Shim Jeo-Young
• Lee Myo-Yong
• Namkoong Kak
• Chung Won-Seok

Classifications

• B01L2300/0819

  Microarrays; Biochips · CPC title

• B01L3/508

  Rigid containers without fluid transport within · CPC title

• C40B60/12 Primary

  for screening libraries · CPC title

• B01L2200/025

  Align devices or objects to ensure defined positions relative to each other · CPC title