Moisture barrier layer dielectric for thermoformable circuits

US9187649B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9187649-B2
Application numberUS-201314049525-A
CountryUS
Kind codeB2
Filing dateOct 9, 2013
Priority dateJan 8, 2013
Publication dateNov 17, 2015
Grant dateNov 17, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.

First claim

Opening claim text (preview).

What is claimed is: 1. A capacitive switch circuit comprising a dielectric barrier layer formed from a polymer thick film moisture barrier layer dielectric composition consisting essentially of: (a) a first organic medium comprising 10-50 wt % thermoplastic urethane resin dissolved in an organic solvent, wherein the weight percent is based on the total weight of said first organic medium; (b) a second organic medium comprising 10-50 wt % thermoplastic phenoxy resin in an organic solvent wherein the weight percent is based on the total weight of said second organic medium; (c) 1-20 wt % diacetone alcohol, wherein the weight percent is based on the total weight of the composition; and (d) 0.1-5.0 wt % fumed silica, wherein the weight percent is based on the total weight of the composition, wherein said capacitive switch circuit is thermoformed and subsequently subjected to an injection molding process. 2. The capacitive switch circuit of claim 1 , wherein said thermoplastic urethane resin is a urethane elastomer or a polyester-based copolymer. 3. The capacitive switch circuit of claim 2 , wherein said thermoplastic urethane resin is a polyester-based copolymer.

Assignees

Inventors

Classifications

  • C08L75/04Primary

    Polyurethanes · CPC title

  • Capacitive touch switches · CPC title

  • using a capacitive movable element · CPC title

  • Constructional details of capacitive touch and proximity switches · CPC title

  • C09D5/00Primary

    Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9187649B2 cover?
This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable si…
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification C08L75/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).