Resin particle having many recesses on the surface thereof

US9187580B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9187580-B2
Application numberUS-99101009-A
CountryUS
Kind codeB2
Filing dateMay 11, 2009
Priority dateMay 21, 2008
Publication dateNov 17, 2015
Grant dateNov 17, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

The present invention provides a resin particle having many recesses on the surface thereof, which has solvent resistance and heat resistance. More specifically, the present invention provides a resin particle having many recesses on the surface thereof which is obtained by using a seed particle, wherein a seed particle component in the resin particle has a crosslinked structure. Since the resin particle having many recesses on the surface thereof of the present invention is excellent in solvent resistance and heat resistance in addition to light diffusing properties, the resin particle is appropriate for use, for example, in not only cosmetics containing silicone oil and the like in a preparation, a light diffusing film and a light diffusing sheet prepared by dispersing resin particles as a light diffusing agent in an organic solvent such as 2-butanone and the like in a production process, and a light diffusing plate prepared by kneading at a high shear force the resin particles as a light diffusing agent with polystyrene or polymethyl methacrylate and the like which melts at a high temperature of approximately 300° C. in a production process.

First claim

Opening claim text (preview).

The invention claimed is: 1. A light diffusing agent comprising a resin particle having many recesses on the surface thereof, comprising a seed particle, wherein a component part of said seed particle has a crosslinked structure; said seed particle is a resin formed of at least one monomer having a silyl group selected from the group consisting of 3-(meth)acryloxypropyl methyl dimethoxysilane, 3-(meth)acryloxypropyl trimethoxysilane, 3-(meth)acryloxypropyl methyl diethoxysilane, and 3-(meth)acryloxypropyl triethoxysilane, and other monomers, wherein an amount of the other monomers used in the resin particle having many recesses on the surface thereof is 100 to 900 parts by mass with respect to 100 parts by mass of the monomer having a silyl group; and said resin particle is obtained by seed-polymerizing a monomer for seed polymerization in a solvent which is at least one selected from the group consisting of acetone, acetonitrile, N,N-dimethylformamide, dimethyl sulfoxide, 1-butanol, 2-propanol, 1-propanol, ethanol, methanol, and a mixed solvent of water with one or more of the preceding solvents in the presence of said seed particle, and crosslinking at least a part of said seed particle in the presence of said seed particle, and crosslinking at least a part of said seed particle. 2. The light diffusing agent according to claim 1 , wherein the method for seed polymerization is a seed dispersion polymerization method. 3. A light diffusing film obtained by applying the light diffusing agent of claim 1 to a film resin with a binder. 4. A light diffusing sheet obtained by applying the light diffusing agent of claim 1 to a sheet resin with a binder. 5. A light diffusing plate obtained by mixing to disperse the light diffusing agent of claim 1 in a transparent matrix resin, and forming it. 6. The light diffusing agent according to claim 1 , wherein the solvent is at least one selected from the group consisting of 1-butanol, 2-propanol, 1-propanol, ethanol, methanol, and a mixed solvent of water with one or more of the preceding solvents.

Assignees

Inventors

Classifications

  • Styrene · CPC title

  • Chemical modification by after-treatment (graft polymers, block polymers, crosslinking with unsaturated monomers or with polymers C08F251/00 - C08F299/00; of conjugated diene rubbers C08C) · CPC title

  • containing no aromatic rings in the alcohol moiety · CPC title

  • comprising acrylic (co)polymers · CPC title

  • containing silicon · CPC title

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What does patent US9187580B2 cover?
The present invention provides a resin particle having many recesses on the surface thereof, which has solvent resistance and heat resistance. More specifically, the present invention provides a resin particle having many recesses on the surface thereof which is obtained by using a seed particle, wherein a seed particle component in the resin particle has a crosslinked structure. Since the resi…
Who is the assignee on this patent?
Hamamoto Shigeki, Kawata Hirotsugu, Yamaguchi Kiyoshi, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08F2/44. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).