Sequenced orthogonal disconnection of electronic modules

US9185819B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9185819-B2
Application numberUS-201414146842-A
CountryUS
Kind codeB2
Filing dateJan 3, 2014
Priority dateJan 3, 2014
Publication dateNov 10, 2015
Grant dateNov 10, 2015

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic enclosure includes a first electronic module, a second electronic module, a third electronic module and a handle. The first electronic module is physically connected to the second electronic module and the third electronic module is physically connected to the second electronic module. The second electronic module vertically disengages from the first electronic module and the third electronic module horizontally disengages from the second electronic module. The handle forces sequenced orthogonal disconnection of the electronic modules such that the third electronic module horizontally disengages from the second electronic module prior to the second electronic module vertically disengages from the first electronic module.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic enclosure comprising: a first electronic module physically connected to a second electronic module that vertically disengages from the first electronic module; a third electronic module physically connected to the second electronic module, the third electronic module horizontally disengages from the second electronic module, and; a handle that forces the third electronic module to horizontally disengage from the second electronic module and subsequently forces the second electronic module to vertically disengage from the first electronic module. 2. The electronic enclosure of claim 1 wherein the handle forces the third electronic module to horizontally disengage from the second electronic module and subsequently forces the second electronic module to vertically disengage from the first electronic module by segmented rotation. 3. The electronic enclosure of claim 2 wherein a first rotation segment allows a user to adequately grasp the handle. 4. The electronic enclosure of claim 2 wherein a second rotation segment causes a disconnection bracket to contact the third electronic module. 5. The electronic enclosure of claim 2 wherein a third rotation segment causes a disconnection bracket to force the third electronic module to horizontally disengage from the second electronic module. 6. The electronic enclosure of claim 2 wherein a fourth rotation segment causes a cam comprised within the second module to force the second electronic module to vertically disengage from the first electronic module. 7. The electronic enclosure of claim 1 wherein the first electronic module is a system board assembly. 8. The electronic enclosure of claim 1 wherein the second electronic module is an auxiliary board assembly. 9. The electronic enclosure of claim 1 wherein the third electronic module is a power supply assembly. 10. A method for sequenced orthogonal disconnection of electronic modules within an electronic enclosure comprising: providing within the electronic enclosure a handle that forces a third electronic module to horizontally disengage from a second electronic module and subsequently forces the second electronic module to vertically disengage from a first electronic module. 11. The method of claim 10 further comprising: providing for segmented rotation of the handle to force the third electronic module to horizontally disengage from the second electronic module and subsequently force the second electronic module to vertically disengage from the first electronic module by segmented rotation. 12. The method of claim 11 wherein segmented rotation of the handle comprises: rotating the handle in a first rotation segment to allow a user to adequately grasp the handle. 13. The method of claim 11 wherein segmented rotation of the handle comprises: rotating the handle in a second rotation segment to cause a disconnection bracket to contact the third electronic module. 14. The method of claim 11 wherein segmented rotation of the handle comprises: rotating the handle in a third rotation segment to cause a disconnection bracket to force the third electronic module to horizontally disengage from the second electronic module. 15. The method of claim 11 wherein segmented rotation of the handle comprises: rotating the handle in a fourth rotation segment to cause a cam comprised within the second module to force the second electronic module to vertically disengage from the first electronic module. 16. The method of claim 10 wherein the first electronic module is a system board assembly. 17. The method of claim 10 wherein the second electronic module is an auxiliary board assembly. 18. The method of claim 10 wherein the third electronic module is a power supply assembly. 19. The method of claim 10 wherein the third electronic module is a hard drive assembly. 20. The method of claim 11 wherein the handle is rotated at least 5 degrees within each rotation segment.

Assignees

Inventors

Classifications

  • Handles; Grips · CPC title

  • for multiple cards · CPC title

  • H05K7/02Primary

    Arrangements of circuit components or wiring on supporting structure · CPC title

  • Receptacles therefor, e.g. card slots, module sockets, card groundings · CPC title

  • having ejection mechanisms · CPC title

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Frequently asked questions

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What does patent US9185819B2 cover?
An electronic enclosure includes a first electronic module, a second electronic module, a third electronic module and a handle. The first electronic module is physically connected to the second electronic module and the third electronic module is physically connected to the second electronic module. The second electronic module vertically disengages from the first electronic module and the thir…
Who is the assignee on this patent?
Lenovo Entpr Solutions Singapore Pte Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).