Method for producing an electrical multi-layer component and electrical multi-layer component

Patent metadata

Field	Value
Publication number	US-9185809-B2
Application number	US-201113642505-A
Country	US
Kind code	B2
Filing date	Apr 18, 2011
Priority date	Apr 22, 2010
Publication date	Nov 10, 2015
Grant date	Nov 10, 2015

Abstract

A method for producing an electrical multi-layer component is described, wherein a first ceramic layer ( 2 ) comprising a first and a second ceramic material ( 3, 4 ) is applied to a ceramic substrate ( 1 ). The first ceramic material ( 3 ) is applied to a first surface partition ( 5 ) of the substrate ( 1 ) by a first inkjet printing step and the second ceramic material ( 4 ) is applied to a second surface partition ( 6 ) of the substrate ( 1 ) by a second inkjet printing step, the second surface partition ( 6 ) surrounding and enclosing the first surface partition ( 5 ). The second ceramic material ( 4 ) is different from the first ceramic material ( 3 ).
Furthermore, an electrical multi-layer component is described.

First claim

What is claimed is:

1. A method for producing an electrical multi-layer component, comprising the steps:
providing a ceramic substrate; and
applying a first ceramic layer to the substrate,
wherein the first ceramic layer comprises a first ceramic material and a second ceramic material, the first ceramic material is applied to a first surface partition of the substrate by a first inkjet printing step, and the second ceramic material is applied to a second surface partition of the substrate by a second inkjet printing step,
wherein the second surface partition surrounds and encloses the first surface partition, and
wherein the second ceramic material is different from the first ceramic material.

2. The method according to claim 1 , wherein the first surface partition has a surface area which is equal to or smaller than 500 μm times 500 μm, preferably equal to or smaller than 100 μm times 100 μm.

3. The method according to claim 1 or 2 , wherein the first ceramic layer has a thickness of equal to or less than 100 μm, preferably of equal to or less than 50 μm.

4. The method according to claim 1 , wherein a first electrode layer is applied to the substrate, the first ceramic layer is applied upon the first electrode layer, and a second electrode layer is applied to the first ceramic layer.

5. The method according to claim 4 , wherein the first and second electrode layers are in direct contact with the first ceramic material.

6. The method according to claim 1 , wherein the first ceramic material has a first relative permittivity and the second ceramic material has a second relative permittivity which is smaller than the first relative permittivity.

7. The method according to claim 6 , wherein the ratio of the first relative permittivity to the second relative permittivity is equal to or greater than 10.

8. The method according to claim 1 , wherein the first ceramic material is a varactor material or a varistor material.

9. The method according to claim 1 , wherein the first ceramic material and the second ceramic material are sintered simultaneously.

10. The method according to claim 1 , wherein a third ceramic material is applied to at least a third surface partition of the substrate by a third inkjet printing step, and
wherein the second surface partition surrounds and encloses the third surface partition.

11. The method according to claim 1 , wherein a second ceramic layer comprising a fourth and a fifth ceramic material is applied to the substrate upon or below the first ceramic layer,
wherein the fourth ceramic material is applied upon a fourth surface partition of the substrate by a fourth inkjet printing step,
wherein the fifth ceramic material is applied upon a fifth surface partition of the substrate by a fifth inkjet printing step,
wherein the fifth surface partition surrounds and encloses the fourth surface partition, and
wherein the fourth and the fifth ceramic material are different from each other.

12. An electrical multi-layer component comprising:
a first ceramic layer on a ceramic substrate,
wherein the first ceramic layer comprises a first ceramic material on a first surface partition of the substrate and a second ceramic material on a second surface partition of the substrate,
wherein the second ceramic material is different from the first ceramic material,
wherein the second surface partition surrounds and encloses the first surface partition,
wherein the first surface partition has a surface area which is equal to or smaller than 500 μm times 500 μm,
wherein the first and second ceramic materials are applied in inkjet printing.

13. The component according to claim 12 , wherein the component is produced by a method comprising:
providing a ceramic substrate; and
applying a first ceramic layer to the substrate,
wherein the first ceramic layer comprises a first ceramic material and a second ceramic material, the first ceramic material is applied to a first surface partition of the substrate by a first inkjet printing step, and the second ceramic material is applied to a second surface partition of the substrate by a second inkjet printing step,
wherein the second surface partition surrounds and encloses the first surface partition, and
wherein the second ceramic material is different from the first ceramic material.

14. The component according to claim 12 or 13 , further comprising:
a first electrode layer and a second electrode layer,
wherein the first electrode layer is applied to the substrate, the first ceramic layer is applied upon the first electrode layer, the second electrode layer is applied upon the first ceramic layer, a top ceramic layer is applied upon the second electrode layer, and the first and the second electrode layers are in direct contact with the first ceramic material.

15. The component according to claim 12 , wherein the first surface partition has a surface area which is equal to or smaller than 100 μm times 100 μm and the first ceramic layer has a thickness of equal to or less than 40 μm.

Assignees

• Testino Andrea
• Epcos Ag

Inventors

• Testino Andrea

Classifications

• H05K1/167

  incorporating printed resistors · CPC title

• H01C17/065

  by thick film techniques, e.g. serigraphy · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K2201/10196

  Variable component, e.g. variable resistor · CPC title

• H05K3/125 Primary

  by ink-jet printing · CPC title