Camera module

Patent metadata

Field	Value
Publication number	US-9185280-B2
Application number	US-201314092394-A
Country	US
Kind code	B2
Filing date	Nov 27, 2013
Priority date	Dec 6, 2012
Publication date	Nov 10, 2015
Grant date	Nov 10, 2015

Abstract

A camera module according to exemplary embodiments of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a base arranged at an upper surface of the PCB, a lens holder arranged at an upper surface of the base to support plural sheets of lenses, a shield can configured to protect the lens holder by being coupled to the upper surface of the base to expose a lateral surface of the base, and a conductive layer formed at the exposed lateral surface of the base.

First claim

What is claimed is:

1. A camera module, the camera module comprising:
a PCB (Printed Circuit Board) mounted with an image sensor;
a base arranged at an upper surface of the PCB;
a lens holder arranged at an upper surface of the base and supporting at least one lens; a shield can configured to protect the lens holder by being coupled to the upper surface of the base to expose a lateral surface of the base; and
a continuous conductive layer formed only on an entire exposed lateral surface of the base wherein said layer is in contact with said lateral surface.

2. The camera module of claim 1 , wherein the conductive layer is formed at the entire exposed lateral surface of the base in a form of an electronic circuit pattern layer.

3. The camera module of claim 1 , wherein the conductive layer is respectively connected to the PCB and the shield can using a conductive adhesive.

4. The camera module of claim 3 , wherein the conductive adhesive is provided with a conductive epoxy, and coated on all parts where the PCB, the shield can and a plating part are mutually brought into contact.

5. The camera module of claim 1 , wherein the shield can is formed with a metal material.

6. The camera module of claim 1 , wherein the shield can is formed with a bottom surface having a size corresponding to that of the base.

7. The camera module of claim 1 , wherein the PCB is formed with a ground terminal at an area connected to the conductive layer.

8. The camera module of claim 1 , wherein each of the base and the lens holder is provided in a shape of a cube, and a width of the lens holder is smaller than that of the base.

9. The camera module of claim 1 , wherein the base is provided with a cubic shape, and the lens holder is provided with a cylinder shape.

10. The camera module of claim 1 , wherein the base is fonned by double-injection molding process, comprising a body part of the base is injection-molded with insulating material, and the conductive layer is formed with a conductive synthetic resin.

11. The camera module of claim 1 , wherein the base is injection-molded while being included with impurities thereinside that react to light and heat during the injection-molding process, and the conductive layer is formed by a surface operation such as a laser exposure to the injection-molded base.

12. The camera module of claim 1 , wherein the base is such that the conductive layer is formed by metalizing an entire surface of a lateral wall surface.

13. The camera module of claim 1 , wherein the shield can is formed to cover the lens holder only.

14. The camera module of claim 1 , wherein the shield can is centrally formed with a through hole through which light included with an image is transmitted to a lens mounted on the lens holder, and the shield can is provided in a box shape of thin metal material.

15. The camera module of claim 3 , wherein an electromagnetic wave of the shield can and the conductive layer is grounded through the PCB.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Sun Joo

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/51

  Housings · CPC title

• H04N5/2257 Primary

  Electricity · mapped topic

• H04N5/2252

  Electricity · mapped topic

• G03B5/00

  Adjustment of optical system relative to image or object surface other than for focusing · CPC title