Electronic device package and fabricating method thereof
US-2024347575-A1 · Oct 17, 2024 · US
Method for reducing tilt of optical unit during manufacture of image sensor
US9184331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9184331-B2 |
| Application number | US-201313766568-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 13, 2013 |
| Priority date | Feb 24, 2011 |
| Publication date | Nov 10, 2015 |
| Grant date | Nov 10, 2015 |
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Abstract
Official abstract text for this publication.
A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for reducing the tilt of an optical unit during manufacturing of an image sensor, comprising the following steps: providing a semimanufacture of the image sensor, which comprises a circuit substrate and an image sensor die, wherein the circuit substrate has a supporting surface and a bottom surface, a plurality of first conductive contacts are provided on the supporting surface, and the image sensor die comprises: a first surface attached to the su…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9184331B2 cover?
- A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to…
- Who is the assignee on this patent?
- Kingpak Tech Inc
- What technology area does this patent fall under?
- Primary CPC classification H10F39/804. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).