Imprinted multi-level optical circuit structure
US-9223087-B2 · Dec 29, 2015 · US
US9182548B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9182548-B2 |
| Application number | US-201113337403-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2011 |
| Priority date | Jan 7, 2011 |
| Publication date | Nov 10, 2015 |
| Grant date | Nov 10, 2015 |
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A plurality of regions for a plurality of optical waveguides are defined on a substrate. Then, optical waveguide under-cladding layers are formed on the respective regions, and dummy under-cladding layers are formed between adjacent ones of the optical waveguide under-cladding layers in a spaced relationship to the optical waveguide under-cladding layers. After cores are formed on the optical waveguide under-cladding layers and the dummy under-cladding layers, an over-cladding layer formation photosensitive resin is applied on the resulting substrate. Subsequently, portions of the resulting photosensitive resin layer for the respective optical waveguides are selectively exposed, and the exposed portions are defined as over-cladding layers. Thus, the optical waveguides are produced as each including the optical waveguide under-cladding layer, the core and the over-cladding layer, and separated from the substrate.
Opening claim text (preview).
What is claimed is: 1. An optical waveguide production method for producing a plurality of optical waveguides, the method comprising: defining a plurality of regions for the plurality of optical waveguides on a substrate; forming optical waveguide under-cladding layers on the respective regions and forming dummy under-cladding layers between adjacent ones of the optical waveguide under-cladding layers in a spaced relationship through application and exposure of an under-cladding layer formation photosensitive resin; forming cores on the optical waveguide under-cladding layers and the dummy under-cladding layers through application and exposure of a core formation photosensitive resin; applying an over-cladding layer formation photosensitive resin over the cores to form a photosensitive resin layer; selectively exposing portions of the over-cladding layer formation photosensitive resin layer without exposing portions of the over-cladding layer formation photosensitive resin layer corresponding to the dummy under-cladding layers and defining the exposed portions as over-cladding layers, whereby the optical waveguides are formed, each including the optical waveguide under-cladding layer, the core and the over-cladding layer on the substrate, whereby the portions corresponding to the dummy under-cladding layers do not contain the over-cladding layer; and selectively separating the optical waveguides from the substrate without separating the dummy under-cladding layers from the substrate. 2. The optical waveguide production method according to claim 1 , wherein the dummy under-cladding layers are each spaced not greater than 300 μm from an adjacent one of the optical waveguide under-cladding layers. 3. The optical waveguide production method according to claim 1 , wherein a plurality of cores are formed on the surface of the dummy under-cladding layer. 4. The optical waveguide production method according to claim 2 , wherein a plurality of cores are formed on the surface of the dummy under-cladding layer. 5. The optical waveguide production method according to claim 1 , wherein the optical waveguide under-cladding layers and the dummy under-cladding layers are formed in the same step. 6. The optical waveguide production method according to claim 2 , wherein the optical waveguide under-cladding layers and the dummy under-cladding layers are formed in the same step. 7. The optical waveguide production method according to claim 3 , wherein the optical waveguide under-cladding layers and the dummy under-cladding layers are formed in the same step.
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