Establishing a thermal profile across a semiconductor chip

Patent metadata

Field	Value
Publication number	US-9178495-B2
Application number	US-201414221859-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Mar 21, 2014
Publication date	Nov 3, 2015
Grant date	Nov 3, 2015

Abstract

Embodiments of the present invention disclose a semiconductor structure and method for establishing a thermal profile across a semiconductor chip. In certain embodiments, the semiconductor structure comprises a through-silicon via formed in a first semiconductor chip having thermal control circuitry, wherein the through-silicon via is formed in a manner to be thermally coupled to the thermal control circuitry and a region of a second semiconductor chip, and wherein the through-silicon via conducts heat from the thermal control circuitry to the region. In other embodiments, the method comprises forming a through-silicon via in a first semiconductor chip having thermal control circuitry. The method also comprises forming the through-silicon via in a manner to be thermally coupled to the thermal control circuitry and a region of a second semiconductor chip, wherein the through-silicon via conducts heat from the thermal control circuitry to the region.

First claim

What is claimed is:

1. A semiconductor structure comprising:
a first semiconductor chip comprising:
a first substrate;
a first device and a second device on said first substrate, said second device selectively controlling said first device such that said first device generates a predetermined amount of heat;
a dielectric layer on said first device and said second device; and,
a conductor extending vertically through said dielectric layer to said first device;

a second s…

Assignees

• IBM
• Globalfoundries Us 2 Llc

Inventors

• Hook Terence B
• Schnabel Christopher M
• Sherony Melanie J

Classifications

• H10W90/722

  Electricity · mapped topic

• H10W90/297

  Electricity · mapped topic

• H10W90/288

  Electricity · mapped topic

• H10W90/26

  Electricity · mapped topic

• H10W72/9415

  Electricity · mapped topic