Circuit Board Wafer with Contacts Mounted on Castellated Edges
US-2024145960-A1 · May 2, 2024 · US
Printed circuit board and electronic device using printed circuit board
US9178294B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178294-B2 |
| Application number | US-201213655049-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 18, 2012 |
| Priority date | Oct 20, 2011 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole.
First claim
Opening claim text (preview).
The invention claimed is: 1. A printed circuit board in which three or more layers of circuit boards are laminated and a large number of through holes for insertion of terminal pins of electronic parts are formed, wherein lands of a conductor material are formed around a first through hole and a second through hole of the large number of through holes on surfaces of a top layer circuit board and a bottom circuit board, and the first land around the first through hole and the secon…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H01R12/585Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9178294B2 cover?
- An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a lan…
- Who is the assignee on this patent?
- Hitachi Automotive Systems Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01R12/585. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).