Wireless apparatus

US9178269B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9178269-B2
Application numberUS-201213447676-A
CountryUS
Kind codeB2
Filing dateApr 16, 2012
Priority dateJul 13, 2011
Publication dateNov 3, 2015
Grant dateNov 3, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to one embodiment, a wireless apparatus includes an antenna, a semiconductor chip and a board. The antenna comprises a radiating element includes a main radiating part. The semiconductor chip is connected with the antenna. The board has a first surface and a second surface, terminals are arranged on the first surface, and the semiconductor chip is arranged on the second surface. The main radiating part is arranged outside a first region and a second region, the first region is defined by imaginary lines passing through centers of peripheral terminals of the terminals, the second region is defined as a region where the first region is orthogonally projected onto the second surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A wireless apparatus, comprising: an antenna including a main radiating part; a semiconductor chip coupled to the antenna; and a board having a first surface and a second surface which is different from the first surface, a plurality of terminals being arranged on the first surface, and the semiconductor chip being arranged on the second surface, wherein when viewed along a first direction perpendicular to the second surface, the main radiating part is…

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Frequently asked questions

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What does patent US9178269B2 cover?
According to one embodiment, a wireless apparatus includes an antenna, a semiconductor chip and a board. The antenna comprises a radiating element includes a main radiating part. The semiconductor chip is connected with the antenna. The board has a first surface and a second surface, terminals are arranged on the first surface, and the semiconductor chip is arranged on the second surface. The m…
Who is the assignee on this patent?
Tsutsumi Yukako, Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification H01Q1/2283. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).