Array substrate and manufacturing method thereof
US-12185597-B2 · Dec 31, 2024 · US
Semiconductor device and method for manufacturing the same
US9178182B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178182-B2 |
| Application number | US-201113248302-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2011 |
| Priority date | Mar 14, 2003 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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Abstract
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To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first substrate; a first adhesive layer over the first substrate; a pixel portion and a driver circuit over the first adhesive layer, the pixel portion comprising: a first transistor over the first adhesive layer; a second transistor over the first adhesive layer; a first electrode over the first transistor; an EL layer over the first electrode; and a second electrode over the EL layer; a second substrate…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10D86/40Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9178182B2 cover?
- To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration…
- Who is the assignee on this patent?
- Takayama Toru, Maruyama Junya, Ohno Yumiko, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10D86/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).