Curable silicone composition, cured product thereof, and optical semiconductor device
US-11879060-B2 · Jan 23, 2024 · US
Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
US9178120B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178120-B2 |
| Application number | US-201113638992-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 30, 2011 |
| Priority date | Apr 2, 2010 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
First claim
Opening claim text (preview).
The invention claimed is: 1. A curable resin composition comprising, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule which is free of any siloxane (Si—O—Si) units, or, reaction products of one or more kinds of compounds selected from the organic compounds having at least two carbon-carbon double bonds reactive with SiH groups per molecule which are free of any siloxane (Si—O—Si) units, with a com…
Assignees
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Classifications
- H10W74/476Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9178120B2 cover?
- The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecu…
- Who is the assignee on this patent?
- Kokubo Tadashi, Ouchi Katsuya, Iwahara Takahisa, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/476. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).