Method for manufacturing an optoelectronic device
US-2024274747-A1 · Aug 15, 2024 · US
US9178111B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178111-B2 |
| Application number | US-201314083927-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2013 |
| Priority date | Dec 18, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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According to one embodiment, a semiconductor light emitting device includes an electrode layer, a first semiconductor layer, a first elongated electrode, a second semiconductor layer, and a light emitting layer. The first semiconductor layer includes a crystal having a cleavage plane. The first semiconductor layer includes a first thin film portion and a thick film portion. The first thin film portion extends in a first direction perpendicular to a stacking direction from the electrode layer toward the first semiconductor layer. The first thin film portion has a first thickness. The thick film portion is arranged with the first thin film portion in a plane perpendicular to the stacking direction. An angle between the first direction and the cleavage plane is not less than 3 degrees and not more than 27 degrees. The first elongated electrode extends in the first direction in contact with the first thin film portion.
Opening claim text (preview).
What is claimed is: 1. A semiconductor light emitting device, comprising: an electrode layer; a first semiconductor layer of a first conductivity type including a crystal having a cleavage plane, the first semiconductor layer including a first thin film portion extending in a first direction perpendicular to a third direction from the electrode layer toward the first semiconductor layer, the first thin film portion having a first thickness, and a thick film portion arranged with…
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