Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
Manufacturing method for a micromechanical component and a corresponding micromechanical component
US9178018B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178018-B2 |
| Application number | US-201314098879-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2013 |
| Priority date | Dec 6, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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Abstract
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A manufacturing method is described for a micromechanical component and a corresponding micromechanical component. The manufacturing method includes the steps: forming at least one crystallographically modified area in a substrate; forming an etching mask having a mask opening on a main surface of the substrate; and carrying out an etching step using the etching mask, the crystallographically modified area and a surrounding area of the substrate being removed and thus forming a cavern in the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method for a micromechanical component, comprising: forming at least one crystallographically modified area in a substrate such that the crystallographically modified area is at least partially amorphous or polycrystalline; forming an etching mask having a mask opening on a main surface of the substrate; and carrying out an etching step using the etching mask such that the crystallographically modified area and a surrounding area of the…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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- What does patent US9178018B2 cover?
- A manufacturing method is described for a micromechanical component and a corresponding micromechanical component. The manufacturing method includes the steps: forming at least one crystallographically modified area in a substrate; forming an etching mask having a mask opening on a main surface of the substrate; and carrying out an etching step using the etching mask, the crystallographically m…
- Who is the assignee on this patent?
- Schelling Christoph, Bosch Gmbh Robert
- What technology area does this patent fall under?
- Primary CPC classification H10D62/124. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).