Semiconductor device and method for manufacturing semiconductor device
US-2024079469-A1 · Mar 7, 2024 · US
US9178013B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178013-B2 |
| Application number | US-201213366707-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 6, 2012 |
| Priority date | Feb 6, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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According to an embodiment, a semiconductor device includes a semiconductor body having a first semiconductor material and a second semiconductor material having a band gap larger than a band gap of the first semiconductor material. A first pn-junction is formed in the first semiconductor material. A second pn-junction is formed by the second semiconductor material and extends deeper into the semiconductor body than the first pn-junction. The second semiconductor material is in contact with the first semiconductor material and forms part of an edge termination zone of the semiconductor device.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a semiconductor body comprising a first semiconductor material and further comprising a second semiconductor material that extends into the semiconductor body from an uppermost surface of the semiconductor body and that has a band gap larger than a band gap of the first semiconductor material; a first pn-junction formed in the first semiconductor material; at least one of a second pn-junction and a heterojunction form…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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