Semiconductor device
US-2024321938-A1 · Sep 26, 2024 · US
US9178010B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178010-B2 |
| Application number | US-201213693901-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 4, 2012 |
| Priority date | Nov 11, 2011 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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A method for doping a dielectric material by pulsing a first dopant precursor, purging the non-adsorbed precursor, pulsing a second precursor, purging the non-adsorbed precursor, and pulsing a oxidant to form an intermixed layer of two (or more) metal oxide dielectric dopant materials. The method may also be used to form a blocking layer between a bulk dielectric layer and a second electrode layer. The method improves the control of the composition and the control of the uniformity of the dopants throughout the thickness of the doped dielectric material.
Opening claim text (preview).
What is claimed: 1. A semiconductor layer stack comprising: a first layer formed on a substrate, wherein the first layer is operable as a first electrode, wherein the first layer comprises crystalline MoO 2 ; a second layer formed on the first layer, wherein the second layer comprises a doped high k dielectric material, wherein the doped high k dielectric material is TiO 2 doped with at least two of Al, Ce, Co, Ga, Gd, Ge, Hf, In, La, Lu, Mg, Mn, Nd, Pr, Sc, Si, Sn, Sr,…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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