Barrier layer on a piezoelectric-device pad
US-2024314500-A1 · Sep 19, 2024 · US
External gettering method and device
US9177828B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9177828-B2 |
| Application number | US-201113024806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 10, 2011 |
| Priority date | Feb 10, 2011 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
First claim
Opening claim text (preview).
What is claimed as new and desired to be protected by Letters Patent of the United States is: 1. An external gettering element for providing gettering to a first substrate of a semiconductor device, said first substrate having a front side at which electrical devices are formed and a stress relieved backside opposite the front side, said external gettering element comprising: a first gettering material, wherein said first gettering material contains an additive which provides the…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9177828B2 cover?
- Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound provid…
- Who is the assignee on this patent?
- Tan Michael, Pour Cheng P, Micron Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W76/48. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).