Method for producing product having uneven microstructure on surface thereof
US-9494857-B2 · Nov 15, 2016 · US
Metal mold, process for manufacturing the same, and molded article produced using the mold
US9174366B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9174366-B2 |
| Application number | US-201314092301-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 27, 2013 |
| Priority date | Feb 18, 2008 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The mold has a mold surface on which is formed as a release film a water-repellent and oil-repellent fluorocarbon-based chemisorbed film having a thickness that is uniform in nanoscale and having a controlled surface energy. As a result, even when a mold has an ultrafine shape on the nanometer scale, the mold allows high precision molding excellent in fluidity and penetrativity of a molding material. In addition, this mold eliminates the application of a release agent and can prevent a release agent from adhering to a molded article.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a releasable mold, comprising: bringing a mold surface into contact with a composite film-forming solution to allow them to react with each other to form a releasable composite film, the solution being obtained by diluting, with an organic solvent: a long-chain substance (1) having one of Formula 3, Formula 4 or Formula 5 a…
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Operations & Transport · mapped topic
- B29C33/58Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US9174366B2 cover?
- The mold has a mold surface on which is formed as a release film a water-repellent and oil-repellent fluorocarbon-based chemisorbed film having a thickness that is uniform in nanoscale and having a controlled surface energy. As a result, even when a mold has an ultrafine shape on the nanometer scale, the mold allows high precision molding excellent in fluidity and penetrativity of a molding mat…
- Who is the assignee on this patent?
- Empire Technology Dev Llc
- What technology area does this patent fall under?
- Primary CPC classification B29C33/58. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).