Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Circuit board and method for manufacturing the same
US9173291B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9173291-B2 |
| Application number | US-201314060345-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 22, 2013 |
| Priority date | Dec 28, 2012 |
| Publication date | Oct 27, 2015 |
| Grant date | Oct 27, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit board comprising: a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction perpendicular to the vertical direction to surround the via structure and made of an insulating…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/116Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9173291B2 cover?
- The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern dis…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K1/116. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).