Light emitting diode package and light emitting module comprising the same

Patent metadata

Field	Value
Publication number	US-9172020-B2
Application number	US-201414310782-A
Country	US
Kind code	B2
Filing date	Jun 20, 2014
Priority date	Oct 27, 2011
Publication date	Oct 27, 2015
Grant date	Oct 27, 2015

Abstract

The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.

First claim

What is claimed is:

1. A light emitting diode package, comprising:
a light emitting diode chip;
a lead frame comprising a chip area on which the light emitting diode chip is disposed; and
a package body comprising a cavity and supporting the lead frame,
wherein:
the chip area is exposed through the cavity;
the lead frame comprises a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area;
the first terminal group and the second terminal group each comprise a first terminal connected to the chip area and a second terminal separated from the chip area;
the second terminal of the first terminal group is exposed through the cavity; and
the second terminal of the second terminal group is buried in the package body and not exposed through the cavity.

2. The light emitting diode package of claim 1 , wherein in the first terminal group, a width of the second terminal inside the package body is greater than a width of the second terminal outside the package body.

3. The light emitting diode package of claim 1 , wherein a width of the second terminal of the first terminal group is greater than a width of the second terminal of the second terminal group inside the package body.

4. The light emitting diode package of claim 1 , wherein in the first terminal group and/or in the second terminal group, a width of the first terminal is greater than a width of the second terminal outside the package body.

5. The light emitting diode package of claim 1 , wherein each first terminal of the first terminal group and the second terminal group extends to opposite sides.

6. The light emitting diode package of claim 5 , wherein each second terminal of the first terminal group and the second terminal group is disposed between the first terminals of the first terminal group and the second terminal group, respectively.

7. The light emitting diode package of claim 1 , wherein the lead frame comprises a connection groove between the first terminal of the first terminal group and the first terminal of the second terminal group.

8. The light emitting diode package of claim 7 , wherein the connection groove is partially exposed through the cavity.

9. The light emitting diode package of claim 1 , wherein the first terminal of the first terminal group and the second terminal group comprises a connection hole buried in the package body.

10. The light emitting diode package of claim 1 , wherein a width of the second terminal of the first terminal group is the same as a width of the second terminal of the second terminal group, outside the package body.

11. The light emitting diode package of claim 1 , wherein a width of the first terminal of the first terminal group is the same as a width of the second terminal of the second terminal group, outside the package body.

12. The light emitting diode package of claim 1 , wherein in the first terminal group, a width of the first terminal is less than a width of the second terminal inside the package body.

13. The light emitting diode package of claim 1 , wherein in the second terminal group, a width of the second terminal is less than a width of the first terminal both inside and outside the package body.

14. The light emitting diode package of claim 1 , wherein a width of the first terminal of the second terminal group is greater than a width of the first terminal of the first terminal group inside the package body.

15. The light emitting diode package of claim 1 , wherein the lead frame comprises:
an upper flat section within the package body;
a lower flat section exposed outside of the package body; and
a connecting section within the package body, the connection section connecting the upper flat section and the lower flat section.

16. The light emitting diode package of claim 15 , wherein the package body comprises an upper portion disposed on a first side of the lead frame and a lower portion disposed on a second side of the lead frame, and
wherein the lead frame comprises a connection hole through which the upper portion and the lower portion are connected to each other.

17. The light emitting diode package of claim 16 , wherein the connection hole is formed in the upper flat section of the lead frame.

18. A light emitting module, comprising:
a printed circuit board;
a light emitting diode package disposed on the printed circuit board; and
a heat sink connected to the printed circuit board,
wherein the light emitting diode package comprises:
a light emitting diode chip;
a lead frame comprising a chip area on which the light emitting diode chip is disposed; and
a package body comprising a cavity and supporting the lead frame,

wherein:
the chip area is exposed through the cavity;
the lead frame comprises a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area;
the first terminal group and the second terminal group each comprise a first terminal connected to the chip area and a second terminal separated from the chip area;
the second terminal of the first terminal group is exposed through the cavity; and
the second terminal of the second terminal group is buried in the package body and not exposed through the cavity.

19. The light emitting module of claim 18 , wherein the heat sink comprises zones comprising different numbers of heat dissipation fins.

20. The light emitting module of claim 19 , wherein first zones of the heat sink disposed directly under the first terminals comprise a greater number of heat dissipation fins than that of a second zone of the heat sink disposed directly under the second terminals.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Kim Byoung Sung
• Lim Sang Eun
• Lee Jae Jin
• Son Yeoun Chul

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/8506

  Containers · CPC title