Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
US-2016336246-A1 · Nov 17, 2016 · US
US9169352B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9169352-B2 |
| Application number | US-201514626745-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 19, 2015 |
| Priority date | Mar 12, 2008 |
| Publication date | Oct 27, 2015 |
| Grant date | Oct 27, 2015 |
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Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.
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What is claimed is: 1. A polymer or prepolymer of a dicyanate compound of formula (Ia): wherein: each m independently is 1 or 2; the moieties R independently represent halogen, cyano, nitro, optionally substituted alkyl, optionally substituted cycloalkyl, optionally substituted alkoxy, optionally substituted alkenyl, optionally substituted alkenyloxy, opti…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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