Electronic control device including interrupt wire

US9166397B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9166397-B2
Application numberUS-201414316012-A
CountryUS
Kind codeB2
Filing dateJun 26, 2014
Priority dateFeb 4, 2011
Publication dateOct 20, 2015
Grant dateOct 20, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic control device comprising: a substrate; a coupling object mounted on the substrate; an interrupt wire configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling with the coupling object, the interrupt wire having a first side end and a second side end facing to each other; a first etching resist region disposed adjacent to the first side end of the interrupt wire; a second etching resist region…

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What does patent US9166397B2 cover?
An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt …
Who is the assignee on this patent?
Denso Corp, Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H05K1/0265. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).