On-chip terahertz thin-film devices
US-2024429627-A1 · Dec 26, 2024 · US
US9166284B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9166284-B2 |
| Application number | US-201213721245-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2012 |
| Priority date | Dec 20, 2012 |
| Publication date | Oct 20, 2015 |
| Grant date | Oct 20, 2015 |
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Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
Opening claim text (preview).
What is claimed is: 1. A method of forming a package structure comprising: forming a discrete antenna on a back side of a device, wherein the discrete antenna comprises an antenna substrate; forming a through antenna substrate via through the antenna substrate, wherein the through antenna substrate via is vertically disposed through the antenna substrate; coupling the through antenna substrate via with a through substrate via that is vertically disposed within the device; and…
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