Package structures including discrete antennas assembled on a device

US9166284B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9166284-B2
Application numberUS-201213721245-A
CountryUS
Kind codeB2
Filing dateDec 20, 2012
Priority dateDec 20, 2012
Publication dateOct 20, 2015
Grant dateOct 20, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a package structure comprising: forming a discrete antenna on a back side of a device, wherein the discrete antenna comprises an antenna substrate; forming a through antenna substrate via through the antenna substrate, wherein the through antenna substrate via is vertically disposed through the antenna substrate; coupling the through antenna substrate via with a through substrate via that is vertically disposed within the device; and…

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What does patent US9166284B2 cover?
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A th…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H10W44/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).