Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
US9166115B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9166115-B2 |
| Application number | US-83729310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2010 |
| Priority date | Dec 27, 2006 |
| Publication date | Oct 20, 2015 |
| Grant date | Oct 20, 2015 |
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A semiconductor light emitting device package including a main body including a supporting member and an outside member on the supporting member; at least one semiconductor light emitting device disposed on the supporting member in which the outside member at least partially surrounds the at least one semiconductor light emitting device; first and second electrodes, at least one electrode of the first and second electrodes at least partially extending under the at least one semiconductor light emitting device; a metallic member disposed under the at least one semiconductor light emitting device and extending beyond outside edges of the at least one semiconductor light emitting device; a first molding part surrounded by the outside member and covering the at least one semiconductor light emitting device; and a second molding part disposed on the first molding part, the second molding part formed in a domed shape.
Opening claim text (preview).
What is claimed is: 1. A semiconductor light emitting device package, comprising: a main body including a supporting member and an outside member on the supporting member; at least one semiconductor light emitting device disposed on the supporting member in which the outside member at least partially surrounds the at least one semiconductor light emitting device; first and second electrodes, at least one electrode of the first and/or second electrodes at least partially extend…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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