Component and method for producing same

Patent metadata

Field	Value
Publication number	US-9162873-B2
Application number	US-201314074877-A
Country	US
Kind code	B2
Filing date	Nov 8, 2013
Priority date	Nov 8, 2012
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.

First claim

What is claimed is:

1. A component, comprising:
a MEMS component having at least one diaphragm structure formed in the front side of the component; and
a support for the MEMS component;
wherein the support at least laterally delimits a cavity adjoining the diaphragm structure,
wherein the support includes at least one electrical feedthrough which allows electrical contacting of the MEMS component through the support,
wherein the electrical feedthrough is integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of the feedthrough includes an electrically conductive coating of a side wall section of the cavity, and
wherein the side wall section having the electrically conductive coating extends from a front side surface facing the MEMS component to a rear side surface of the support.

2. The component of claim 1 , wherein the cavity adjoining the diaphragm structure of the MEMS component includes a through opening in the support which is closed off on the rear side opposite from the MEMS component by a base part.

3. The component of claim 1 , wherein the cavity adjoining the diaphragm structure of the MEMS component includes a blind hole-like recess in the front side of the support facing the MEMS component.

4. The component of claim 1 , wherein the support includes an interposer system having essentially the same chip surface area as the MEMS component.

5. The microphone component of claim 1 , further comprising:
a MEMS microphone component in which the cavity in the support adjoining the diaphragm structure functions as the rear volume.

Assignees

• Zoellin Jochen
• Ehrenpfordt Ricardo
• Schelling Christoph
• Graf Juergen
• Ante Frederik
• Curcic Michael
• Bosch Gmbh Robert

Inventors

• Zoellin Jochen
• Ehrenpfordt Ricardo
• Schelling Christoph
• Graf Juergen
• Ante Frederik
• Curcic Michael

Classifications

• H10W72/9413

  on encapsulations · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• H01L41/31

  Electricity · mapped topic

• B81C1/00158

  Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039) · CPC title