Acoustic wave device

Patent metadata

Field	Value
Publication number	US-9160301-B2
Application number	US-201213616265-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Nov 1, 2011
Publication date	Oct 13, 2015
Grant date	Oct 13, 2015

Abstract

An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a multilayer structure that laminates a plurality of layers and has a plurality of surfaces for forming wiring which respective principal surfaces of the plurality of layers provide;
a chip that includes an acoustic wave filter and is mounted on a first surface, the first surface being a front surface of the multilayer structure;
a resin unit that is formed on the first surface and seals the chip;
a wiring pattern that is formed in contact with a second surface different from the first surface and is electrically connected to at least one of resonators which constitute the acoustic wave filter;
a ground pattern that is formed in contact with the second surface along at least a part of the wiring pattern, the ground pattern being away from the wiring pattern in a planar direction of the second surface, the ground pattern including a first portion surrounding the wiring pattern; and
an external terminal that is formed on a third surface different from the first and the second surfaces and is electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface,
wherein a part of the wiring pattern that comes closest to the first portion of the ground pattern in the planar direction of the second surface and that is located in contact with the second surface is substantially formed in parallel with the first portion of the ground pattern.

2. The acoustic wave device according to claim 1 , wherein
the wiring pattern and the ground pattern are electrically connected to each other on the third surface.

3. The acoustic wave device according to claim 1 , wherein the acoustic wave filter is a ladder filter in which a plurality of series resonators and a plurality of parallel resonators are connected in a shape of a ladder, and the wiring pattern electrically connects between at least one of the parallel resonators and the external terminal connected to a ground.

4. The acoustic wave device according to claim 1 , wherein the acoustic wave filter is a transmission filter in a duplexer in which the transmission filter and a reception filter are connected to a common antenna terminal.

5. The acoustic wave device according to claim 1 , wherein the part of the wiring pattern is connected to a via formed between the first surface and the second surface.

6. The acoustic wave device according to claim 1 , wherein the at least one of resonators which constitute the acoustic wave filter is a surface acoustic wave resonator.

7. The acoustic wave device according to claim 1 , wherein the at least one of resonators which constitute the acoustic wave filter is a film bulk acoustic resonator.

8. The acoustic wave device according to claim 1 , wherein the chip is flip-chip mounted on the first surface.

9. The acoustic wave device according to claim 1 , wherein:
the acoustic wave filter includes a transmission filter connected between an antenna terminal and a transmission terminal and a reception filter connected between the antenna terminal and a reception terminal; and
the part of the wiring pattern is closer to the transmission filter than the reception filter.

10. The acoustic wave device according to claim 1 ,
wherein the ground pattern further includes a second portion that is surrounded by the first portion,
wherein another part of the wiring pattern that comes closest to the second portion of the ground pattern in the planar direction of the second surface and that is located in contact with the second surface is substantially formed in parallel with the second portion of the ground pattern.

11. An acoustic wave device comprising:
a multilayer structure that laminates a plurality of layers and has a plurality of surfaces for forming wiring which respective principal surfaces of the plurality of layers provide;
a chip that includes an acoustic wave filter and is mounted on a first surface, the first surface being a front surface of the multilayer structure;
a resin unit that is formed on the first surface and seals the chip;
a wiring pattern that is formed on a second surface different from the first surface and is electrically connected to at least one of resonators which constitute the acoustic wave filter;
a ground pattern that is formed on the second surface along at least a part of the wiring pattern, the ground pattern being away from the wiring pattern; and
an external terminal that is formed on a third surface different from the first and the second surfaces and is electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface,
wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern, and
wherein an interval between the wiring pattern and the ground pattern in an area where the wiring pattern comes closest to the ground pattern is identical with a minimum interval between wiring patterns on the second surface.

Assignees

• Tajima Motoyuki
• Takezaki Tooru
• Tsukidate Hitoshi
• Taiyo Yuden Kk

Inventors

• Tajima Motoyuki
• Takezaki Tooru
• Tsukidate Hitoshi

Classifications

• H03H9/1042

  the enclosure being defined by a housing formed by a cavity in a resin · CPC title

• H03H9/1014

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/0576

  including surface acoustic wave [SAW] devices · CPC title

• H03H9/0571 Primary

  including bulk acoustic wave [BAW] devices · CPC title