Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Method for producing a semiconductor module arrangement
US9159698B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9159698-B2 |
| Application number | US-201414161022-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2014 |
| Priority date | Jan 24, 2013 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for producing a semiconductor module arrangement, the method comprising: providing a semiconductor module comprising a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount and fitted to the circuit mount, a plurality of electrical connections each having a free first end and a second end electrically conductively connected to the circuit mount, wherein each of the elec…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10W72/073Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9159698B2 cover?
- A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is ro…
- Who is the assignee on this patent?
- Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification H10W72/073. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).