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Glass wafers for semiconductors fabrication processes and methods of making same
US9159587B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9159587-B2 |
| Application number | US-201414488943-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2014 |
| Priority date | Nov 5, 2010 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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Abstract
Official abstract text for this publication.
The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of fabricating an electronic device, the method comprising: introducing a glass wafer into equipment used in semiconductor fabrication, wherein the glass wafer comprises: a glass having a coefficient of thermal expansion from about 2×10 −6 /° C. to about 9×10 −6 /° C., an indexing feature configured to be recognized by the semiconductor fabrication equipment, and a coating on at least a portion of one face of the glass, wherein the coati…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9159587B2 cover?
- The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expans…
- Who is the assignee on this patent?
- Corning Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W95/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).