Method of forming a molded substrate electronic package and structure
US-2018158767-A1 · Jun 7, 2018 · US
US9155408B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9155408-B2 |
| Application number | US-201414152662-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2014 |
| Priority date | Jan 10, 2013 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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A pillow cover is provided that includes a first panel and a second panel perimetrically joined with the first panel such that inner surfaces of the first and second panels define a cavity having a void volume. The first and second panels are each made from a first material. An opening extends through the inner surface of the first panel and an outer surface of the first panel. The pillow cover includes a patch covering the opening. The patch is made from a second material that is different than the first material.
Opening claim text (preview).
What is claimed is: 1. A pillow cover, comprising: a first panel; and a second panel perimetrically joined with the first panel such that inner surfaces of the first and second panels define a cavity having a void volume, wherein the first and second panels are each made from a first material, wherein an opening extends through the inner surface of the first panel and an outer surface of the first panel, the opening having a size, shape and arrangement, the pillow cover comp…
Human Necessities · mapped topic
Human Necessities · mapped topic
Human Necessities · mapped topic
Human Necessities · mapped topic
Human Necessities · mapped topic
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