Transformer module and power module
US-2024363282-A1 · Oct 31, 2024 · US
Wiring board
US9155196B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9155196-B2 |
| Application number | US-201414290193-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 29, 2014 |
| Priority date | May 30, 2013 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor.
First claim
Opening claim text (preview).
What is claimed is: 1. A wiring board, comprising: a substrate having a laminated-inductor forming portion and comprising a plurality of first insulation layers and a second insulation layer formed on a first side of the plurality of first insulation layers such that the plurality of first insulation layers has the laminated-inductor forming portion; and a planar conductor formed on the second insulation layer of the substrate and configured to shield electromagnetic force gener…
Assignees
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Classifications
- H05K1/165Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9155196B2 cover?
- A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield elec…
- Who is the assignee on this patent?
- Ibiden Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/165. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).