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US-11906118-B2 · Feb 20, 2024 · US
Flexible circuit board and its method for production
US9155193B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9155193-B2 |
| Application number | US-201013641769-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 24, 2010 |
| Priority date | Apr 19, 2010 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.
First claim
Opening claim text (preview).
The invention claimed is: 1. A flexible circuit board comprising: an insulating film made of a thermoplastic resin; a wiring layer formed on said insulating film; and an insulating layer made of a thermoplastic resin and formed on said wiring layer; wherein a spiral part shaped into a spiral shape is formed in at least a part of said flexible circuit board; said spiral part is shaped in such a manner that a part of a circumferential surface and another adjacent part of the…
Assignees
Inventors
Classifications
- H05K1/028Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9155193B2 cover?
- A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board i…
- Who is the assignee on this patent?
- Kajiya Atsushi, Yoshihara Hidekazu, Nippon Mektron Kk
- What technology area does this patent fall under?
- Primary CPC classification H05K1/028. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).