Light emitting device package and lighting device with the same

Patent metadata

Field	Value
Publication number	US-9153749-B2
Application number	US-201113339231-A
Country	US
Kind code	B2
Filing date	Dec 28, 2011
Priority date	Apr 19, 2011
Publication date	Oct 6, 2015
Grant date	Oct 6, 2015

Abstract

The present invention relates to a light emitting device package and a lighting device with the same. The light emitting device package comprises a package body having a first surface and a second surface, wherein the first surface has a mounting portion positioned thereon, and a through hole provided therein to pass through the first surface and the second surface, at least one pair of first electrodes on the first surface, at least one pair of second electrodes on the second surface connected to the first electrodes through the through hole respectively, a light emitting device on the mounting portion connected to the first electrodes electrically, a light wavelength conversion layer positioned on the light emitting device, and a protective layer on the light wavelength conversion layer for sealing the mounting portion.

First claim

What is claimed is:

1. A light emitting device package comprising:
a package body having a first surface and a second surface, wherein a mounting portion is positioned in the package body, and a through hole is provided therein to pass through the first surface and the second surface, wherein the mounting portion has an inward recess from the first surface toward the second surface;
at least one pair of first electrodes on the first surface, wherein the first electrodes are extended to a side of the mounting portion;
at least one pair of second electrodes on the second surface connected to the first electrodes through the through hole, respectively;
a light emitting device on the mounting portion connected to the first electrodes, electrically;
a light wavelength conversion layer in the inward recess;
a protective layer on the light wavelength conversion layer for sealing the mounting portion, wherein the protective layer is configured for damp proofing the light wavelength conversion layer; and
a double reflective layer or multiple reflective film configured to be a planar shape, arranged between the protective layer and the light emitting device, and which transmits and reflects a light selectively,
wherein the double reflective layer or multiple reflective film is arranged in the inward recess and under the light wavelength conversion layer.

2. The light emitting device package as claimed in claim 1 , wherein the protective layer is mounted to the first surface with an adhesive layer.

3. The light emitting device package as claimed in claim 2 , wherein the adhesive layer is positioned along an edge of the first surface.

4. The light emitting device package as claimed in claim 1 , wherein the protective layer has a lens shape.

5. The light emitting device package as claimed in claim 1 , wherein the protective layer has a light extraction pattern provided thereto.

6. The light emitting device package as claimed in claim 1 , further comprising an encapsulation on the light emitting device.

7. The light emitting device package as claimed in claim 1 , further comprising an anti-reflection layer on the light emitting device.

8. The light emitting device package as claimed in claim 1 , wherein the second electrodes have an inserting portion projected downward.

9. The light emitting device package as claimed in claim 8 , wherein the inserting portion is inserted in, and mounted to, an inserting hole in a circuit board.

10. The light emitting device package as claimed in claim 8 , wherein the inserting portion is two or more than two branches from one first electrode.

11. The light emitting device package as claimed in claim 1 , wherein the double reflective layer or the multiple reflective film is positioned between the light emitting device and the light wavelength conversion layer.

12. The light emitting device package as claimed in claim 1 , wherein the first electrodes contact the protective layer.

13. The light emitting device package as claimed in claim 2 , wherein the first electrodes are positioned on a side of the adhesive layer.

14. The light emitting device package as claimed in claim 1 , wherein the first electrodes are positioned between the first surface and the protective layer.

15. The light emitting device package as claimed in claim 1 , wherein the light wavelength conversion layer is arranged between the protective layer and the double reflective layer or the multiple reflective film.

16. The light emitting device package as claimed in claim 6 , wherein the double reflective layer or the multiple reflective film contacts the encapsulation.

17. The light emitting device package as claimed in claim 1 , wherein the double reflective layer or the multiple reflective film transmits a blue light (B) while reflecting other lights including a red light (R) and a green light (G).

18. The light emitting device package as claimed in claim 1 , wherein the first electrodes and the adhesive layer contact the protective layer.

19. The light emitting device package as claimed in claim 1 , wherein the light wavelength conversion layer is between the protective layer and the double reflective layer or multiple reflective film.

Assignees

• Kim Mangeun
• Park Chilkeun
• Kim Sangcheon
• Choi Moongoo
• Lg Electronics Inc

Inventors

• Kim Mangeun
• Park Chilkeun
• Kim Sangcheon
• Choi Moongoo

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/841

  Reflective coatings, e.g. dielectric Bragg reflectors · CPC title