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Thermal cycler with vapor chamber for rapid temperature changes
US9149809B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9149809-B2 |
| Application number | US-201213460983-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 1, 2012 |
| Priority date | May 6, 2011 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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Abstract
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Rapid and uniform temperature changes in the wells of a microplate or any thin-walled plate that contains an array of reaction wells or sample receptacles are achieved by the use of heating and cooling elements with a vapor chamber interposed between such elements and the microplate. The upper surface of the vapor chamber and the underside of the sample plate in certain embodiments are complementary in shape, i.e., they have identical but oppositely directed contours in the areas around each of the sample receptacles, to provide continuous surface contact along the surface of each receptacle. In other embodiments, an intermediary plate is placed between the vapor chamber and the well plate, with the top surface of the intermediary plate being complementary in shape to the underside of the well plate.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus for thermal cycling in an array of sample receptacles, said apparatus comprising: a hollow body having a single internal cavity with a working fluid therein that is partially vaporized, wherein said hollow body has a top surface with depressions therein that are spaced and shaped to receive a plurality of sample receptacles and thereby to place said depressions in direct and continuous contact with said undersides of said sample receptacles, sai…
Assignees
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B01L7/52Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9149809B2 cover?
- Rapid and uniform temperature changes in the wells of a microplate or any thin-walled plate that contains an array of reaction wells or sample receptacles are achieved by the use of heating and cooling elements with a vapor chamber interposed between such elements and the microplate. The upper surface of the vapor chamber and the underside of the sample plate in certain embodiments are compleme…
- Who is the assignee on this patent?
- Guo Kun, Chu Daniel Y, Patt Paul, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification B01L7/52. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).